- Packaging：
-
- Package / Case：
-
- Supplier Device Package：
-
- Input：
-
Découvrez les produits 7
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Package / Case | Supplier Device Package | Input | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Package / Case | Supplier Device Package | Input | |
|
Microchip Technology |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 16MLF
|
Tape & Reel (TR) | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | |||
|
|
Microchip Technology |
1,911
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 16MLF
|
Cut Tape (CT) | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | |||
|
|
Microchip Technology |
1,911
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 16MLF
|
- | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | |||
|
|
Microchip Technology |
2,160
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 16MLF
|
Tube | 16-VFQFN Exposed Pad，16-MLF? | 16-MLF? (3x3) | CML，LVDS，LVPECL | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8MLF
|
Tape & Reel (TR) | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | LVDS | |||
|
|
Microchip Technology |
302
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8MLF
|
Cut Tape (CT) | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | LVDS | |||
|
|
Microchip Technology |
302
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8MLF
|
- | 8-VFDFN Exposed Pad，8-MLF? | 8-MLF? (2x2) | LVDS |
