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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Conditions sélectionnées:
Découvrez les produits 429
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
1,584
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | - | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 5.00°C/W @ 200 LFM | 9.40°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2,113
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 50.8MM
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220, TO-202 | 0.500" (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 600 LFM | 7.50°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
116
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 38.5X37.6X14MM
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Top Mount | Copper | Rectangular, Fins | 1.480" (37.59mm) | 1.516" (38.50mm) | - | Push Pin | BGA | 0.551" (14.00mm) | - | 2.60°C/W @ 200 LFM | 15.90°C/W | AavSHIELD 3C | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
125
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 90X90X10MM
|
Top Mount | Copper | Square, Fins | 3.543" (90.00mm) | 3.543" (90.00mm) | - | Push Pin | BGA | 0.394" (10.00mm) | - | 1.30°C/W @ 200 LFM | 4.50°C/W | AavSHIELD 3C | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
18,071
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK MOD BLACK
|
Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.500" (12.70mm) | - | Clip | TO-220, TO-262 | 0.500" (12.70mm) | 1.5W @ 40°C | 7.00°C/W @ 400 LFM | 27.30°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
1,382
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 COPPER
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
201
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Bolt On | TO-3 | 0.750" (19.05mm) | 4.0W @ 30°C | 2.50°C/W @ 400 LFM | 6.20°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDER TAB BLACK
|
- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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|
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Aavid, Thermal Division of Boyd Corporation |
452
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK TO-220 .250" COMPACT
|
Board Level | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.520" (13.21mm) | - | Bolt On | TO-220 | 0.250" (6.35mm) | 1.5W @ 50°C | 10.00°C/W @ 500 LFM | 32.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
82
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER HEATSINK 60X60X22MM
|
Top Mount | Copper | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | Push Pin | BGA | 0.866" (22.00mm) | - | 0.80°C/W @ 300 LFM | 7.20°C/W | AavSHIELD 3C | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
761
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .515"TO-220
|
Board Level, Vertical | Copper | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | - | Clip and PC Pin | TO-220 | 0.515" (13.08mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 20.30°C/W | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
421
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
TO-5 PUSH-ON HEATSINK 6.35MM
|
Board Level | Aluminum | Cylindrical | - | - | 0.318" (8.07mm) ID, 0.500" (12.70mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 35.00°C/W @ 200 LFM | 60.00°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
135
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220 SOLDERPIN 50.8MM
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 10.0W @ 50°C | 2.00°C/W @ 300 LFM | 4.80°C/W | Black Anodized | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
17
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
60760 EXTRUSION 1X3.25"X4
|
Top Mount | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | 3.250" (82.55mm) | - | Adhesive | - | 1.000" (25.40mm) | 4.0W @ 20°C | - | - | - | ||
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|
|
Aavid, Thermal Division of Boyd Corporation |
11
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
68855 EXTRUSION 0.46X7.201"X4
|
Top Mount | Aluminum | Rectangular | 48.000" (1219.20mm) | 7.200" (182.88mm) | - | Adhesive | - | 0.460" (11.68mm) | - | 0.50°C/W @ 500 LFM | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
2
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
62285 EXTRUSION 1.63X6.75"X4
|
Top Mount | Aluminum | Rectangular, Fins | 48.000" (1219.20mm) | 6.750" (171.45mm) | - | Adhesive | - | 1.630" (41.40mm) | - | 0.65°C/W @ 200 LFM | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
14
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
64500 EXTRUSION 1.062X5.9"X4
|
Top Mount | Aluminum | Rectangular, Pin Fins | 48.000" (1219.20mm) | 5.900" (149.86mm) | - | Adhesive | - | 1.063" (27.00mm) | - | 0.50°C/W @ 500 LFM | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
65445 EXTRUSION 1.312X7.34"X4
|
Top Mount | Aluminum | Rectangular, Fins | 48.000" (1219.20mm) | 7.340" (186.44mm) | - | Adhesive | - | 1.312" (33.32mm) | - | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
10
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
62545 EXTRUSION 2.75X14.75"X4
|
Top Mount | Aluminum | Rectangular, Fins | 48.000" (1219.20mm) | 14.750" (374.65mm) | - | Adhesive | - | 2.750" (69.85mm) | - | - | - | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
283
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 LOW PROFILE .375"
|
Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.750" (44.45mm) | - | Bolt On | TO-3 | 0.375" (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | 7.00°C/W | Black Anodized |
