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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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- Conditions sélectionnées:
Découvrez les produits 429
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | - | Bolt On | TO-220 | 0.380" (9.65mm) | 6.0W @ 50°C | 4.00°C/W @ 300 LFM | 6.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.380" (35.05mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 200 LFM | 9.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | - | Clip and PC Pin | TO-220 | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 0.850" (21.59mm) | 1.000" (25.40mm) | - | Clip and PC Pin | TO-220, TO-262 | 0.500" (12.70mm) | 2.0W @ 40°C | 9.00°C/W @ 200 LFM | 18.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Copper | Rectangular, Fins | 1.040" (26.42mm) | 0.866" (22.00mm) | - | Clip | TO-220 | 0.375" (9.52mm) | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Top Mount | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 0.530" (13.46mm) | - | Thermal Tape, Adhesive (Not Included) | 28-DIP | 0.190" (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM | 32.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK
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- | - | - | - | - | - | - | - | - | - | - | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | - | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 2.5W H=1.5" BLK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 0.640" (16.26mm) | - | Bolt On | TO-220 | 0.640" (16.26mm) | 3.0W @ 50°C | 3.00°C/W @ 500 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.670" (42.42mm) | 1.000" (25.40mm) | - | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 4.0W @ 40°C | 4.00°C/W @ 300 LFM | 11.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 24-DIP BLK ANODIZED
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Top Mount | Aluminum | Rectangular, Fins | 1.460" (37.08mm) | 1.008" (25.60mm) | - | Press Fit, Slide On | 24-DIP | 0.580" (14.73mm) | 1.0W @ 20°C | 6.00°C/W @ 400 LFM | 20.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-218, TO-247 | 0.500" (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | - | Bolt On | TO-218 | 1.000" (25.40mm) | 5.0W @ 30°C | 3.00°C/W @ 200 LFM | 5.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40-PIN DIP GLUE-ON BLK
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Top Mount | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 0.530" (13.46mm) | - | Thermal Tape, Adhesive (Not Included) | 40-DIP | 0.190" (4.83mm) | 1.0W @ 30°C | 16.00°C/W @ 300 LFM | 27.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.860" (21.84mm) | - | Clip and PC Pin | TO-220 | 0.395" (10.03mm) | 1.5W @ 40°C | 8.00°C/W @ 500 LFM | 23.20°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK 20-DIP BLK ANODIZED
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Top Mount | Aluminum | Rectangular, Fins | 1.055" (26.80mm) | 0.700" (17.78mm) | - | Press Fit, Slide On | 20-DIP | 0.556" (14.12mm) | 2.0W @ 60°C | 20.00°C/W @ 200 LFM | 39.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 1.000" (25.40mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 30°C | 4.00°C/W @ 400 LFM | 13.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.375" (34.93mm) | - | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | 8.0W @ 60°C | 4.00°C/W @ 200 LFM | 8.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | 1.020" (25.91mm) | - | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized |
