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- Thermal Resistance @ Natural：
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- Conditions sélectionnées:
Découvrez les produits 180
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH SMALL CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.80°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH MEDIUM CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.80°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH TALL CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.283" (32.60mm) | 1.283" (32.60mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.80°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 38 X 38 X 12MM
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH SMALL CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH MEDIUM CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED WITH TALL CLIP
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.461" (37.10mm) | 1.461" (37.10mm) | - | Clip | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FAN TOP PRESSON TO8
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Fan Top | Top Mount | Brass | Cylindrical | - | - | 1.250" (31.75mm) OD | Press Fit | TO-8 | 0.330" (8.38mm) | - | - | 41.00°C/W | - | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK PRESS ON WO/HRDWR TO-8
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- | Top Mount | Brass | Cylindrical | - | - | - | Press Fit | TO-5 | 0.250" (6.35mm) | 0.5W @ 41°C | - | - | Dull Nickel | |||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK PRESS ON NICKEL TO-18
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- | Top Mount | Brass | Cylindrical | 0.340" (8.64mm) | 0.220" (5.59mm) | 0.220" (5.59mm) OD | Bolt On | TO-18 | - | - | - | - | Dull Nickel | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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THERMAL LINK PRESSON TO-18
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Fan Top | Top Mount | Beryllium Copper | Cylindrical | - | - | 0.500" (12.70mm) OD | Press Fit | TO-18 | 0.250" (6.35mm) | - | - | 150.00°C/W | - | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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THERMAL LINK PRESSON NKL TO-5
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- | Top Mount | Brass | Cylindrical | 0.370" (9.40mm) | 0.380" (9.65mm) | 0.380" (9.65mm) OD | Press Fit, Bolt On | TO-5 | - | - | - | 82.00°C/W | Dull Nickel | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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THERMAL LINK PRESSON TO-5
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Fan Top | Top Mount | Beryllium Copper | Cylindrical | - | - | 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | - | - | 81.10°C/W | - | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 35X35X12MM
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.366" (34.70mm) | 1.366" (34.70mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 3.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 40X40X12MM
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.560" (39.62mm) | 1.560" (39.62mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 2.80°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED 43X43X15MM
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.575" (14.60mm) | - | 2.00°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APR | Top Mount | Aluminum | Square, Pin Fins | 1.657" (42.10mm) | 1.657" (42.10mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.575" (14.60mm) | - | 2.00°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
Enquête
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MOQ: 1 MPQ: 1
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HEATSINK PRESSON PANEL MNT TO-92
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- | Board Level, Vertical | Beryllium Copper | Rectangular | 0.113" (2.87mm) | 0.530" (13.46mm) | - | Bolt On and Clip | - | 0.575" (14.60mm) | - | - | - | Unfinished |
