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Découvrez les produits 255
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Series Mounting Type Termination Convert From (Adapter End) Convert To (Adapter End) Housing Material Pitch - Mating Contact Finish - Mating Pitch - Post Contact Finish - Post Number of Pins Board Material
228-1290-29-0602J
3M
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MOQ: 1  MPQ: 1
RECEPTACLE DIP SOCKET 28POS .4"
Textool Through Hole Solder DIP,0.4" (10.16mm) Row Spacing DIP,0.4" (10.16mm) Row Spacing Polysulfone (PSU),Glass Filled 0.070" (1.78mm) Gold 0.070" (1.78mm) Gold 28 -
68-505-110-P
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER PLCC TO 68PGA
Correct-A-Chip 505 Through Hole Solder PLCC PGA - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 68 FR4 Epoxy Glass
20-301550-10
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER SOIC TO 20PLCC
Correct-A-Chip 301550 Through Hole Solder SOIC PLCC - 0.050" (1.27mm) - 0.100" (2.54mm) Tin-Lead 20 FR4 Epoxy Glass
20-301550-20
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER SOIC TO 20PLCC
Correct-A-Chip 301550 Through Hole Solder SOIC PLCC - 0.050" (1.27mm) - 0.100" (2.54mm) Tin-Lead 20 FR4 Epoxy Glass
218-3341-09-0602J
3M
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MOQ: 1  MPQ: 1
SOCKET ADAPTER 18DIP TO 18DIP
Textool Through Hole Solder DIP,0.3" (7.62mm) Row Spacing DIP,0.3" (7.62mm) Row Spacing Polysulfone (PSU),Glass Filled 0.100" (2.54mm) Gold 0.100" (2.54mm) Gold 18 -
08-665000-00
Aries Electronics
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MOQ: 1  MPQ: 1
SCK ADAPT 8P SOIC-W TO SOIC 0.6
Correct-A-Chip 665000 Surface Mount Solder SOIC-W SOIC - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 8 FR4 Epoxy Glass
20-350001-11-RC
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER SOJ TO 20DIP 0.3
Correct-A-Chip 350000 Through Hole Solder SOJ DIP,0.3" (7.62mm) Row Spacing - 0.050" (1.27mm) - 0.100" (2.54mm) Tin 20 FR4 Epoxy Glass
10-665000-00
Aries Electronics
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MOQ: 1  MPQ: 1
SCK ADAPT 10P SOIC-W TO SOIC 0.6
Correct-A-Chip 665000 Surface Mount Solder SOIC-W SOIC - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 10 FR4 Epoxy Glass
224-5248-09-0602J
3M
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MOQ: 1  MPQ: 1
RECEPTACLE DIP SOCKET 24POS .3"
Textool Through Hole Solder DIP,0.3" (7.62mm) Row Spacing DIP,0.3" (7.62mm) Row Spacing Polysulfone (PSU),Glass Filled 0.100" (2.54mm) Gold 0.100" (2.54mm) Gold 24 -
1106396-40
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER DIP TO 40DIP 0.6
Correct-A-Chip 1106396 Through Hole Solder DIP,0.3" (7.62mm) Row Spacing DIP,0.6" (15.24mm) Row Spacing Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 0.100" (2.54mm) Tin 40 -
1107254-40
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER DIP TO 40DIP 0.3
Correct-A-Chip 1107254 Through Hole Solder DIP,0.6" (15.24mm) Row Spacing DIP,0.3" (7.62mm) Row Spacing Polyamide (PA46),Nylon 4/6,Glass Filled 0.100" (2.54mm) Gold 0.100" (2.54mm) Tin 40 -
12-665000-00
Aries Electronics
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MOQ: 1  MPQ: 1
SCK ADAPT 12P SOIC-W TO SOIC 0.6
Correct-A-Chip 665000 Surface Mount Solder SOIC-W SOIC - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 12 FR4 Epoxy Glass
1111903
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPT SOWIC TO 24DIP 0.4
Correct-A-Chip 1111903 Through Hole Solder SOWIC DIP,0.4" (10.16mm) Row Spacing - 0.050" (1.27mm) - 0.100" (2.54mm) Tin-Lead 24 FR4 Epoxy Glass
14-665000-00
Aries Electronics
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MOQ: 1  MPQ: 1
SCK ADAPT 14P SOIC-W TO SOIC 0.6
Correct-A-Chip 665000 Surface Mount Solder SOIC-W SOIC - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 14 FR4 Epoxy Glass
18-35W000-11-RC
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPT SOIC-W TO 18DIP 0.3
Correct-A-Chip 35W000 Through Hole Solder SOIC-W DIP,0.3" (7.62mm) Row Spacing - 0.050" (1.27mm) - 0.100" (2.54mm) Gold 18 FR4 Epoxy Glass
18-665000-00
Aries Electronics
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MOQ: 1  MPQ: 1
SCK ADAPT 18P SOIC-W TO SOIC 0.6
Correct-A-Chip 665000 Surface Mount Solder SOIC-W SOIC - 0.050" (1.27mm) - 0.050" (1.27mm) Tin-Lead 18 FR4 Epoxy Glass
16-35W000-11-RC
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPT SOIC-W TO 16DIP 0.3
Correct-A-Chip 35W000 Through Hole Solder SOIC-W DIP,0.3" (7.62mm) Row Spacing - 0.050" (1.27mm) - 0.100" (2.54mm) Gold 16 FR4 Epoxy Glass
16-307349-11-RC
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER PLCC TO 16DIP 0.3
Correct-A-Chip 307349 Through Hole Solder PLCC DIP,0.3" (7.62mm) Row Spacing - 0.050" (1.27mm) Gold 0.100" (2.54mm) Gold 16 FR4 Epoxy Glass
28-35W000-11-RC
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPT SOIC-W TO 28DIP 0.3
Correct-A-Chip 35W000 Through Hole Solder SOIC-W DIP,0.3" (7.62mm) Row Spacing - - - 0.050" (1.27mm) Gold 28 FR4 Epoxy Glass
18-351000-10
Aries Electronics
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MOQ: 1  MPQ: 1
SOCKET ADAPTER SSOP TO 18DIP 0.3
Correct-A-Chip 351000 Through Hole Solder SSOP DIP,0.3" (7.62mm) Row Spacing - 0.026" (0.65mm) - 0.100" (2.54mm) Tin-Lead 18 FR4 Epoxy Glass