- Packaging：
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- Operating Temperature：
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- Height Above Board：
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- Number of Positions：
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- Contact Finish：
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- Contact Material：
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- Housing Material：
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- Flat Flex Type：
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- Connector/Contact Type：
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- FFC，FCB Thickness：
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- Locking Feature：
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- Conditions sélectionnées:
Découvrez les produits 100
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Features | Height Above Board | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC，FCB Thickness | Locking Feature | |
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Molex Connector Corporation |
788
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.30MM R/A
|
Bulk | Easy-On 500797 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.041" (1.05mm) | 15 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 23POS 0.30MM R/A
|
Bulk | Easy-On 500797 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.041" (1.05mm) | 23 | Gold | 0.012" (0.30mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP)，Glass Filled | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
18
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 11POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 11 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
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|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 11POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 11 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 15 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
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|
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Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 19POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 19 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
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|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 21POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 21 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 25POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 25 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 27 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 33 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 39POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 39 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 45POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 45 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 51POS 0.30MM R/A
|
Tape & Reel (TR) | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 51 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 15POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 15 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 19POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 19 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 21POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 21 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 25POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 25 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 27POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 27 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 31POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 31 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock | ||
|
|
|
Molex Connector Corporation |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN FPC BOTTOM 33POS 0.30MM R/A
|
Bulk | Easy-On 54809 | -20°C ~ 85°C | Solder Retention，Zero ion Force (ZIF) | 0.051" (1.30mm) | 33 | Tin Bismuth | 0.012" (0.30mm) | 50V | Phosphor Bronze | Liquid Crystal Polymer (LCP) | FPC | Contacts，Bottom | 0.20mm | Flip Lock |
