- Operating Temperature:
-
- Number of Positions:
-
- Contact Finish:
-
- Housing Material:
-
- Actuator Material:
-
- Conditions sélectionnées:
Découvrez les produits 89
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Features | Number of Positions | Contact Finish | Housing Material | Actuator Material | ||
Molex,LLC |
14,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
14,436
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
14,436
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 12POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 12 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,604
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,604
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 24POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 24 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
2,422
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
2,422
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 30POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 30 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,430
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
4,430
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 8POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 8 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,698
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,698
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 10POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 10 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,887
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
6,887
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 16POS 0.50MM R/A
|
- | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 16 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 20POS 0.50MM R/A
|
Tape & Reel (TR) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 20 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled | ||||
Molex,LLC |
2,588
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN FFC BOTTOM 20POS 0.50MM R/A
|
Cut Tape (CT) | -40°C ~ 85°C | Solder Retention,Zero ion Force (ZIF) | 20 | Tin Bismuth | Polyamide (PA),Nylon,Glass Filled | Polyphenylene Sulfide (PPS),Glass Filled |