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- Conditions sélectionnées:
Découvrez les produits 15
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Type | Voltage - Rated | Current - Supply | Impedance | Size / Dimension | Termination | Output Type | Sensitivity | S/N Ratio | Voltage Range | Port Location | Height (Max) | Shape | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Type | Voltage - Rated | Current - Supply | Impedance | Size / Dimension | Termination | Output Type | Sensitivity | S/N Ratio | Voltage Range | Port Location | Height (Max) | Shape | |
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PUI Audio，Inc. |
1,605
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC COND ANALOG OMNI -35DB
|
Bulk | POM | Electret Condenser | 2V | 500μA | 2.2 kOhms | 0.236" Dia (6.00mm) | Solder Pads | Analog | -35dB ±4dB | 68dB | 2V ~ 10V | Top | 0.146" (3.70mm) | Circular | ||
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|
|
TDK InvenSense |
10,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Tape & Reel (TR) | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Bottom | 0.039" (0.98mm) | Rectangular | ||
|
|
|
TDK InvenSense |
11,164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Cut Tape (CT) | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Bottom | 0.039" (0.98mm) | Rectangular | ||
|
|
|
TDK InvenSense |
11,164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Digi-Reel | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Bottom | 0.039" (0.98mm) | Rectangular | ||
|
|
|
TDK InvenSense |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Tape & Reel (TR) | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Top | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
8,793
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Cut Tape (CT) | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Top | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
8,793
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS MULTI-MODE OMNI -38DB
|
Digi-Reel | - | MEMS (Silicon) | - | 190μA | - | 0.138" L x 0.104" W (3.50mm x 2.65mm) | Solder Pads | Analog | -38db ±1dB | 67dB | 1.52V ~ 3.63V | Top | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL I2S OMNI -26DB
|
Tape & Reel (TR) | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，I2S | -26dB ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
2,235
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL I2S OMNI -26DB
|
Cut Tape (CT) | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，I2S | -26dB ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
2,235
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL I2S OMNI -26DB
|
Digi-Reel | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，I2S | -26dB ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL OMNI -26DB
|
Tape & Reel (TR) | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，TDM | -26 ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL OMNI -26DB
|
Cut Tape (CT) | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，TDM | -26 ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
TDK InvenSense |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MEMS DIGITAL OMNI -26DB
|
Digi-Reel | - | MEMS (Silicon) | - | 1.5mA | - | 0.157" L x 0.118" W (4.00mm x 3.00mm) | Solder Pads | Digital，TDM | -26 ±1dB @ 94dB SPL | 65dB | 1.62V ~ 3.63V | Bottom | 0.043" (1.10mm) | Rectangular | ||
|
|
|
Mallory Sonalert Products Inc. |
142
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
MIC MAG ANLG OMNI -46DB 9.7X6.7
|
Bulk | PMOF | Magnetic | 4.5V | 500μA | 2.2 kOhms | 0.382" Dia (9.70mm) | PC Pins | Analog | -46dB ±2dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.272" (6.90mm) | Circular | ||
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|
|
Mallory Sonalert Products Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
MIC MAG ANLG OMNI -40DB 9.7X6.7
|
Bulk | PMOF | Magnetic | 4.5V | 500μA | 2.2 kOhms | 0.382" Dia (9.70mm) | Solder Pads | Analog | -40dB ±2dB @ 94dB SPL | 58dB | 1V ~ 10V | Top | 0.272" (6.90mm) | Circular |
